霸刀分享-国机金刚石超薄划片刀打破国外垄断，国产替代能否引领产业新飞跃？
金刚石在半导体关键耗材领域取得重大突破，已实现最薄10微米超薄金刚石划片刀的批量生产，月出货量达10万片，彻底打破国外垄断，完成国产替代，成为我国半导体关键耗材自主可控的标志性成果。
超薄金刚石划片刀是半导体晶圆“后道工艺”中晶圆切割环节的核心耗材，直接影响芯片良率与性能。此前，该类产品长期依赖进口，属于典型的“卡脖子”关键材料。
国机金刚石（郑州三磨超硬材料有限公司）依托三磨所的技术积淀，实现了多项硬核突破。在极致薄度方面，刀片最薄达10微米，仅为普通纸张厚度的七分之一，每薄1微米，单片4英寸晶圆可多产出约1万颗芯片；在超高精度与稳定性上，一片4英寸晶圆可被精准划切约2000道，产出约80万颗芯片，切缝质量要求“稳如外科手术”；在高可靠性与量产能力方面，产品已通过多种半导体晶圆验证，平均月出货量达10万片，实现稳定批量供应。
对比进口依赖前的状态，国机金刚石在最薄厚度、单晶圆产能、月出货量、应用适配性等关键指标上均有显著提升，达国际先进水平，实现“微米级”自主可控，提升了芯片产出密度与良率，标志着规模化商业落地，支撑国产第三代半导体快速发展。
该突破不仅实现了单一产品国产化，更带动河南打造“郑南商许超硬材料产业集群”，推动产业从规模优势迈向高端制造跃升。同时，它与金刚石热沉片、大单晶金刚石共同构成国机精工“功能化金刚石”三大应用方向，形成完整闭环。
下一步，国机金刚石将重点向“前道工序延伸”及拓展至“8/12英寸大尺寸晶圆”适配，持续强化国产替代深度。
Can domestic substitutes lead to a new leap in the industry? The ultra-thin scraper of the national machinery diamond breaks the foreign monopoly
Diamond has made significant breakthroughs in the field of key semiconductor consumables, and has achieved mass production of ultra-thin diamond scribing knives with a of only 10 microns, with a monthly shipment of 100,000 pieces, completely breaking the foreign monopoly, completing domestic substitution, and becoming a achievement of China's key semiconductor consumables that are independently controllable.
The ultra-thin diamond scribing knife is the core consumable in the wafer cutting link of the "back-end process" of semiconductor wafers, affecting the chip yield and performance. Previously, such products have long relied on imports and belong to typical "bottleneck" key materials.
Guojixing Diamond (Zhengzhou Sanmao Superhard Material Co., Ltd.), relying on the technical accumulation of Sanma Institute, has achieved a number of hard-core breakthroughs. In terms of extreme thinness, the blade is as thin as 10 microns, which is only oneseventh of the thickness of ordinary paper. Every micron thinner, a 4-inch wafer can produce about 10,000 more chips; in terms of-high precision and stability, a 4-inch wafer can be precisely diced into about 2,000 lines, producing about 800,00 chips, and the quality of the cut is required to be "stable as surgery"; in terms of high reliability and mass production capacity, the products have passed a variety of semiconductor verification, with an average monthly shipment of 100,000 pieces, achieving stable mass supply.
Compared with the state before import dependence, Guojixing has made significant improvements in key indicators such as the thinnest thickness, single crystal wafer, monthly shipment volume, and application adaptability, reaching the international advanced level. It has achieved "micrometer-level" self-control, improved the output density and yield of, marking the large-scale commercial landing and supporting the rapid development of domestic third-generation semiconductors.
More than achieving the domestic production of a single product, this breakthrough has also spurred Henan to create the "Zhengnan Shangxu Super Material Industry Cluster", propelling the industry from scale advantage towards a leap in high-end manufacturing. At the same time, it, along with diamond thermal sinking film and large crystal diamond, constitutes the three major application directions of "functionalized diamond" of Guojixingong, forming a complete closed loop.
In the next step, Guojangsha will focus on "extending to the front-end process" and expanding to the "8/12-inch large-size wafer" adaptation, continuously strengthening the of domestic substitution.